5.5 W/m·K Thermal Conductive Silicone Gap Pad
Basic Info
Thermal Conductive Silicone Gap Pad Silicone-based Thermal Interface Material 5.5 W/m.KThermal Conductive Silicone Gap Pad Silicone-based Thermal Interface Material 5.5 W/m.K
Application
Electronic components rarely make perfect contact with a heat sink.
Small gaps caused by:
Component height differences
Surface roughness
Mechanical tolerances
Uneven mounting surfaces
Component-to-heatsink spacing
can trap air and significantly reduce heat transfer.
A thermal gap pad fills these spaces and creates a continuous thermal interface between the heat source and the cooling component.
Compared with thermal grease or paste, a pre-formed thermal pad is easier to handle, cleaner during assembly and more consistent in thickness.
Typical Applications
CPU & GPU Cooling
Thermal pads can be used between processors, memory components, VRAM, voltage-regulation components and heat sinks where a defined thermal gap needs to be filled.
LED Lighting
High-power LEDs generate considerable heat during operation. Thermal gap pads help transfer heat from LED modules to aluminum housings or heat sinks.
Power Electronics
Suitable for thermal management of:
MOSFETs
IGBTs
Power modules
Voltage regulators
Transformers
Power supplies
PCB & Electronic Modules
The material can be used between heat-generating components and metal heat spreaders, housings or cooling structures.
Battery & Energy Systems
Thermal interface pads can be used to transfer heat between battery-related components and cooling plates or enclosures, depending on the required thermal, electrical and mechanical properties.
Consumer Electronics
Potential applications include:
Desktop computers
Gaming hardware
Laptops
Displays
Networking equipment
Communication devices
Industrial control electronics
Custom Thermal Pad Solutions
Not every application can use the same thermal pad.
The required material depends on several factors, including:
Thermal conductivity + gap thickness + compression + hardness + component geometry + electrical insulation requirements
We can provide customized thermal interface pads according to your application.
Available Customization
Thickness
Length and width
Die-cut shape
Hole and opening positions
Hardness
Color
Adhesive options
Thermal conductivity grade
Packaging
Custom die-cut thermal pads can be produced to match the exact geometry of your components, reducing the need for manual cutting during assembly.
How to Select the Right Thermal Gap Pad
Choosing a thermal pad based only on thermal conductivity is not enough.
1. Measure the Actual Gap
The pad thickness should be selected according to the actual gap between the component and heat sink.
For example, a 2mm thermal pad is suitable when the assembly requires approximately 2mm of gap filling, provided the pad's compression characteristics match the application.
2. Consider Compression
A softer material may conform better to uneven surfaces, while a harder material may be preferable where mechanical stability is more important.
3. Check Thermal Conductivity
Higher thermal conductivity does not automatically mean better overall thermal performance.
The actual thermal resistance also depends on:
Pad thickness
Contact pressure
Surface flatness
Interface quality
Heat source power
4. Check Electrical Requirements
For applications around exposed electrical components, confirm the required dielectric strength and volume resistivity of the selected grade.
5. Consider the Final Shape
For mass production, custom die-cut parts can improve assembly efficiency and provide more consistent positioning.